1. Wire bond
    1. 目的
      1. 將NAND Die 與SBT做wire boud 的連接
    2. bonding method
      1. ball bonding
        1. 3 steps
          1. bond pad
          2. die bond pad
          3. =ball bond
          4. SBT bond pad
          5. =wedge bond
          6. 1.bond on die bond pad
          7. ball bond, so call FAB(Free Air Ball)
          8. create by EFO (electronic Flame-Off, kind of electrical spark)
          9. 2.wire loop
          10. 製作loop height
          11. 保留適當金線距離以穩定機械性質
          12. 3.bond on SBT bond pad
          13. wedge bond/stitch bond
      2. wedge bonding
        1. bond pad
          1. die bond pad
          2. =wedge bond
          3. SBT bond pad
          4. =wedge bond
        2. Wedge bonding machine
    3. wire bond線寬
      1. 1.0 mil = 25.4um
      2. 0.8 mil = 20.32um
      3. 0.7 mil =17.77um
    4. 4 major wire bonding materials
      1. golden
        1. 貴
        2. 延展性
        3. 抗腐(氧化)姓
      2. copper
        1. 相較金便宜
        2. 抗氧化佳
        3. 需要較多能量去bonding
        4. bonding force相較金來說更高
      3. silver
        1. 相較金便宜
        2. reflectivity is better
      4. aluminum
        1. 需要的能量較低
        2. 需要的線徑較粗(100um)，可以容許的電流較大
        3. //