1. Chapter 1
   1. Goal of This Tutorial
      1. Understand the process of testing
      2. Get familiar with the terms used in testing
      3. Testing as a problem of economics
   2. Introduction
      1. IC Design and Manufacture process
         1. Design Phase
            1. Specification
            2. Function and performance requirements
            3. Die size estimation
            4. Power analysis
            5. Early I/O assignment
            6. Architecture Design
            7. High-level description block diagrams
            8. IP/Cores selection(to a specific platform)
            9. SW/HW partition/design
            10. Chip Design
            11. Logic Synthesis
            12. Timing verification
            13. Placement and Route and Layout
            14. Physical synthesis
            15. Test development and plan
         2. Production Phase
            1. Fabrication
            2. Test
            3. First silicon debug
            4. Characterization
            5. Production tests
      2. VLSI Testing
         1. Objectives
            1. Ensure product quality
            2. Diagnosis & repair
         2. Challenges
            1. Test time exploded for exhaustive testing
            2. Too many input pins → too many input patterns
            3. High automatic test equipment (ATE) cost for functional tests
            4. Testing circuits with high clock rates
            5. Deep sub-micron/nano effects
            6. Test power > design power
            7. Integration of analog/digital/memories
            8. SOC complexities
         3. Costs
            1. Test equipment cost
            2. Analog/digital signal and measuring instrumentation
            3. Test head
            4. Test controller (computer & storage)
            5. Test development cost
            6. Test planning
            7. Test program development
            8. Debug
            9. Testing-time cost
            10. Time using the equipment to support testing
            11. Time to market
            12. Test personnel cost
            13. Training
            14. Working
         4. Types
            1. Characterization testing
            2. Design debug and verification
            3. Determine the characteristics of chips in silicon
            4. Setup final specifications and production tests
            5. Production testing
            6. To all fabricated parts
            7. To enforce quality requirements
            8. The test set is short
            9. High coverage of modeled faults
            10. Test cost and time are the main drivers
            11. Failure mode analysis(FMA)
            12. To failed parts
            13. To locate the cause of misbehavior
            14. Results can be used to improved the design or the manufacturing process
            15. An important step for improving chip production yield
            16. 分支主題 4
2. Chapter 2
3. Chapter 3
4. Chapter 4
5. Chapter 5
6. Special Topic
   1. WAT and Testing Structure Design